MEYS MOBILITY projects focus on the personal exchange between researchers to further improve international cooperation and the exchange of professional contacts. From the beginning of 2023, a new MOBILITY project started between CEPLANT and HAWK researchers. Project 8J23DE002 aims to functionalize and coat fibers by PECVD at atmospheric pressure and advanced coating thickness measurement using LIBS (Laser Breakdown Spectroscopy).
At the end of May 2023, our colleagues, Dr. Zlata Kelar Tučeková and Dr. Jakub Kelar visited colleagues at HAWK Hochschule in Göttingen, the University of Applied Sciences and Arts in Germany, for the first time. Both parties attended a kickoff meeting introducing not only the share research topic but also the introduction of both parties, their research in general, and the people working on this research. This first mobility exchange aimed to tour the labs and get acquainted with the equipment and facilities at the researchers' disposal. "Among the top-notch was the laboratory of atmospherics pressure discharges and LIBS laboratory. We are excited to try new experiments," comments Dr. Kelar.
Prof. Christoph Gerhard supervises the research activities at project partner. The calibration of measurement by LIBS taking place in Germany will be a joint venture. CEPLANT researchers will create samples of different coated substrates. HAWK researchers will use LIBS and develop specific models for studied materials. Dr. Kelar Tučeková comments: "Our goal is to credibly determine the thickness of deposited coatings using LIBS from newly created model materials, for example, for non-woven and glass fibers and other non-homogeneous materials."
The MOBILITY project will result in shared publications focused on ongoing research activities. Moreover, the project offers junior and senior researchers opportunities to broaden their knowledge and network internationally. Thus, the project partners from HAWK will travel and visit the research facilities at the CEPLANT center and the Department of Physical Electronics and vice versa.